Revolutionizing FPC Manufacturing: Shenzhen Tunsing Launches High-Performance PI heating film FPC cover film

In the fast-evolving electronics manufacturing landscape of 2026, finding reliable, high-performance materials is key to staying ahead. Shenzhen Tunsing Plastic Products Co., Ltd. , a leading innovator in advanced materials , is proud to showcase its premier line of Polyimide (PI) Hot Melt Adhesive Films (东升PI膜热固片). Specifically engineered to meet the rigorous demands of Flexible Printed Circuit (FPC) lamination, this product delivers the thermal, chemical, and electrical reliability modern electronics require.

Tunsing's PI Hot Melt Adhesive Film is designed to optimize the production process and enhance the durability of final electronic assemblies.

• Optimized for Fast Lamination: Designed to streamline high-speed production lines with quick-press compatibility.

• Exceptional Dimensional Stability: Maintains precise structural integrity under intensive manufacturing conditions.

• Superior Resistance: Offers outstanding electrical performance, chemical resistance, and thermal tolerance.

• Excellent Glue Overflow Control: Carefully controlled adhesive flow ensures clean, flawless FPC lamination.

Every roll of Tunsing PI Hot Melt Adhesive Film is engineered with a high-integrity, three-layer structure:

1. Protective Film

2. Adhesive (接着剂)

3. PI Film Base

To cater to diverse manufacturing needs, we provide a variety of standard configurations alongside fully customizable options for width, adhesive thickness, and roll length.

Standard Product Specifications

Tunsing films are rigorously tested against strict international electronics standards (IPC-TM-650) to guarantee elite field performance.

To ensure the best yield and performance, Tunsing suggests the following handling conditions:

1. Storage Conditions

Store in a cool, dry environment below 10°C and under 70% RH. Under these conditions, the product maintains a shelf life of 3 months.

2. Lamination Process (Quick Press Method)

• Step 1: Pre-Pressing

  • Temperature: 180°C

  • Pressure: 0 Kgf/cm²

  • Time: 10 seconds

• Step 2: Molding Press

  • Temperature: 180°C

  • Pressure: 35 Kgf/cm² (Gauge Pressure: 100 Kgf/cm²)

  • Time: 100 seconds

3. Curing (Post-Bake)

Bake at 160°C for 60 minutes to achieve complete adhesive cross-linking and maximum bond strength.

Note: Pressing conditions may vary depending on your specific machinery and substrates. We recommend establishing custom manufacturing baselines through localized testing.

Based in the heart of Shenzhen's high-tech industrial district , Shenzhen Tunsing Plastic Products Co., Ltd. specializes in advanced hot melt adhesive solutions. We are dedicated to providing global manufacturers with stable, highly customizable, and premium-grade materials.